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Gold is used for several purposes in the manufacture of printed circuit boards: Contacts, Solderability and Bonding. In general, the application of gold to the panel is classified as Panel Plating, Spot Plating or Tab Plating. Eidschun leads the way with rugged, dependable gold plating systems that offer unique engineering features that increase productivity, reduce dragout, improve gold distribution, and make more efficient use of your factory floor space. We offer manual systems, semi-automatic systems and fully automatic systems for low, medium and high volume production. Our experience and technology has made the Eidschun name synonymous with gold plating manufacturing technology for every process including Electrolytic, Immersion, Electroless and Tab Plating. |
Eidschun: Metal Finishing Systems Electronics Finishing Systems Hoist Systems Materials Handling Eidschun PCB Wet Process Systems: |
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E100 Automatic Tab Plating Systems
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Eidschun E100 Tab Platers are available in two standard sizes: the
E110 and the larger E120. Both systems are built on a stainless steel
frame with polypropylene process tanks. The conveyor is a fiberglass
linkbelt with molded natural rubber grip pads. Stainless steel fasteners
are used throughout the system and control components are housed in
a NEMA 12 enclosure. While the equipment is simplified in design for
easy operation and maintenance, these Eidschun Tabmatic Systems are
top of the line and built to last. They offer excellent gold plating
distribution and an automatic materials handling option.
E150 Systems for Deep Gold Plating
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Often referred to as "Deep Gold," panel plating is preferred over
tab plating whenever numerous surfaces on the interior tabs must be
gold plated and production becomes costly due to labor and material
requirements. The result of shearing panels to accommodate a tab plater
also produces small panels that become more difficult to handle. Panel
Plating is also preferred when plating edge connectors (tabs) or bonding
surfaces. When plating for tabs, a combination of soft gold strike and
hard gold system will produce a high quality product capable of meeting
most environmental testing requirements. Plating for a bondable surface
requires a different gold chemistry that meets specific needs depending
on the type of bonding to be used. Silver may also be specified for
bonding.
For additional information please download the following brochures:
sales@eidschun.com
727-572-9867 voice 727-573-9198 fax
5181 - 113th Avenue North, Clearwater, FL 33760 USA
Eidschun Engineering, Copyright 2005, all rights reserved