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Eidschun E200 Systems are designed for copper plating of today's high-technology
printed circuits. We offer a wide range of models with a variety of hoist systems to meet the needs of
printed circuit manufacturers including prototype work, short run, and high volume production. The robust
E200 product line features stainless steel construction for 24/7 operation with low MTBF and MTTR. E200
systems are designed for each customer's specific production requirements with full consideration of
their required product technology, product size and volume of production. Various etch resists are
also available including: tin, tin-lead, nickel, tin-nickel and gold.
Eidschun E200 systems feature advanced machine concepts such as dynamic tank scheduling, closed
loop positioning, high hoist speeds with precise load placement, in-process inspection, automatic
anode retrieval and placement, liquid agitation, very low water usage, and spray rinsing. E200 systems
are also available with full automation of load and unload operations, environmental enclosures, and
resource recovery systems designed to eliminate waste generation. E200 plating racks are designed for
operator ergonomics, cathode shielding for excellent plating distribution, and contact isolation to
minimize or eliminate rack plate-up.
E200 Systems offer:
· Auto load/unload equipment options
· Panel plating and pattern plating
· Racking options: one down, two down and three down
· Process engineering and control system (PECS) option
· Special features:
Air or solution agitation
Rack vibration and bumping
Inner layer plating
Flex circuit plating
Standard or submerged anodes
Anode diaphragm and shielding
Automated anode maintenance
Rectification support for all technologies
For additional information please download the following brochures:
Eidschun/ASI
sales@eidschun.com
727-572-9867 voice 727-573-9198 fax
5181 - 113th Avenue North, Clearwater, FL 33760 USA
Eidschun Engineering, Copyright 2005, all rights reserved
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